Capability
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PRODUCTION CAPABILITY |
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Certifications |
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ISO 9001:2008 |
Yes |
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TS 16949 |
Yes |
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ISO 14001 |
Yes |
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RoHS Compliant |
Yes |
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Other |
Yes |
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Surface Finishes |
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HASL |
3-25 um |
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HASL-Lead free |
3-25 um |
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Immersion Tin |
0,80-1,20 um |
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Immersion Silver |
0,12-0,38 um |
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ENIG (immersion gold) |
Ni:2-3,75 um,0,05-1,20 um |
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OSP |
Yes |
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Electrolytic Hard Gold (Au thickness) |
0,025-1,27 um |
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Electrolytic Soft Gold (Au thickness) |
0,025-1,20 um |
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Electrolytic Gold For Wire Bond |
0,38-0,75 um |
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Selective Finishes (More than one finish) |
ENIG + OSP / HASL+Gold finger / ENEPIG |
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Copper thickness |
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0.5-6 oz |
Yes |
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Other |
Specail 10 oz |
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Layers & Board thickness |
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Single sided |
0,1-8,0 mm |
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Double sided |
0,2-8,0 mm |
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Multilayer |
0,4-6,0 mm |
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4 – 6 layer |
0,4-6,0 mm |
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8 –12 layer |
1-6 mm |
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Over 12 layer |
1,4-6,0 mm |
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Max.layer count-Flex |
8 |
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Max.layer count-Rigid / Flex |
8 |
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Material Types |
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FR-4 / FR4 (170) / FR4 (180 |
Yes |
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Flex |
Yes |
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Rigid / Flex |
Yes |
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Ceramic |
Rogers |
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Polyimide |
yes |
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Hybrid |
Rogers+FR-4;PTFE+FR-4 |
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Aluminum |
Bergquist & Tolking & BoYu , others |
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Minimum Line Width and Spacing |
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3mil |
Yes |
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Minimum Drilled Hole Size |
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Laser drilling |
4 mil |
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CNC Drill |
8 mil |
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Minimum Tolerances |
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PTH |
+/-0,05 mm |
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NPTH |
+/-0,05 mm |
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Outline-routed |
+/-0,10 mm |
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Outline-scored |
+/-0,15 mm |
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Scoring |
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20°, 30°, 45°, 60° |
Yes |
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Jump Scoring |
Yes |
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Soldermask |
|
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Colors available |
Green, Black, White, Blue, Yellow, Red |
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Legend Print/Silkscreen |
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Colors available |
White, Yellow , Black , Red , Blue , Pink |
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Additional Process Capabilities |
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Peelable Mask |
Yes |
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Max.diameter to tent with peelable mask |
3,0 mm |
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Max.peelable mask thickness |
0,40 mm |
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Via hole filler soldermask (100% fill) |
Yes |
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Via hole filler soldermask max.hole diameter |
0,60 mm |
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Conductive Hole Filler (Silver/Copper) |
Yes |
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Carbon Ink minimum spacing |
0,15 mm |
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Half-hole plating |
Yes |
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Edge Plating |
Yes |
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Min.hole wall plating thickness |
25 um |
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Countersinks |
90° |
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Bevelling |
20°, 30°, 45°, 60° |
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Controlled depth routing |
Yes |
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Hard Gold Finger (Gold thickness) |
0,025 – 1,27 um |
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Blind Via Construction |
Yes |
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Buried Via Construction |
Yes |
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Via in pad |
Yes |
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Controlled Impedance |
Yes |